FICS Research was recently featured as a highlight of the University of Florida in the current issue of the international ASM Materials Solutions Publication, Electronic Device Failure Analysis: A Resource for Technical Information and Industry Developments.

Read the full article HERE.

ASM International is “the world’s largest association of materials engineers and scientists” and is considered “the preeminent association for engaging and connecting materials professionals and their organizations to the resources necessary to solve problems, improve outcomes, and advance society”.

The edition also features an article by FICS Research faculty entitled “The Power of IC Reverse Engineering for Hardware Trust and Assurance“.